Tecasint 2021

Posted : admin On 4/13/2022

TECASINT 2021 Graphite Filled PI Polyimide Properties, Sheet, Rod, Cut To Size, TECASINT Parts, Tech. Support, Get A Quote. TECASINT 2021 black is a plastic reinforced with 15% graphite and based on the base polymer TECASINT 2011. It is particularly suitable for tribological applications owing to its improved friction and wear behavior. Thanks to its self-lubricating property, TECASINT 2021 is well suited to lubricated and dry applications. TECASINT 2021 is a plastic reinforced with 15% graphite and based on the base polymer TECASINT 2011. It is particularly suitable for tribological applications owing to its improved friction and wear behavior. Thanks to its self lubricating property, TECASINT 2021 is.

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DATASHEET PLASTICS FOR MACHINING

HEMABO
DIN-BENAMING

ENSINGER

MITSHUBISHI

RÖCHLING

HMPE 300

Polystone G

HMPE 500

Polystone D

UHMPE 1000

Polystone M

PA 4.6

Tecamid 46 (Red Brown)Ertalon 4.6Sustamid 46

PA 6 C

Tecast TErtalon 6 PLASustamid 6G

PA 6 C Elastomere

Tecarim 1500 (Yellow)

PA 6 C MoS2

Tecast TMNylatron GSMSustamid 6G MO

PA 6 C Oil

Tecast LErtalon LFXSustamid 6G OL

PA 6 C Solid Lubricat

PA 6 E

PA 6 E GF30

PA 6 E MoS2

PA 6.6

PA 6.6 GF30

PA 6.6 MoS2

PAI

Tecator 50133Duratron T4203 PAI

PAI GF30

Duratiron T5530 PAI

PAI PTFE + CS

Tecator 5031 PVXDuratron T4503 PAI

PAI Static Dissipative

Semitron ESd 520HR

PBT GF30

PEEK

TecapeekKetron 1000 PeekSustapeek

PEEK CA30

Ketron CA30 PeekSustapeek CF30

PEEK GF PTFE CS

Tecaglide (Green)Nylatron NSMSustaglide

PEEK GF30

Tecapeek GF30Kreton GF Peek

PEEK Mineral

Tecapeek TS

PEEK PTFE

Tecapeek TF10 (Blue)Kreton TX Peek

PET

TecapetErtalyteSustadur PET

PET PTFE

Tecapet TFErtalyte TXSustadur PET GLD 130

PI

Tecasint 2011

PI + CS15

Tecasint 2021

PI + CS15 + PTFE

Tecasint 2061

PI + CS40

Tecasint 2031

PI + MoS2

Tecasint 2391

POM-C

Tecaform AH (Natural)Ertacetal CSustarin C

POM-C Anti Static

Tecaform AH SDSustarin C ESD 90

POM-C GF25

Tecaform AH GF25Sustarin C GF25

POM-H

Tecaform ADErtacetal HSustarin H

POM-H PTFE

Tecaform AD AFErtacetal H-TFSustarin H AF

PP

Polystone P

PPE

Tecanyl 731 (Grey)

PPE + GF30

Tecanyl GF30

PPS

TecatronTechtron PPSSustratron PPS

PPS GF PTFE CS

Tecatron PVXSustatron PPS MOD

PPS GF40

Tecatron GF40Sustatron PPS GF40

PTFE

Tecaflon PTFE

PVDF

Tecaflon PVDFSusta PVDF
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Tecasint 2021 Mlb

TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it’s long term thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction. Superior high temperature characteristics (TECASINT™ 2000 series can operate up to 536° F continuously)Excellent long-term thermal stabilityOutstanding bearing and wear properties (at elevated temperatures, TECASINT™ 2000 formulations offer superior wear rates)Excellent creep resistanceHigh strength and stiffness propertiesHigh purity characteristics (only extremely low levels of extractables and ionic impurities are apparent in TECASINT™ 2011)Good chemical resistance (TECASINT™ 2000 series is not attacked by common solvents or fuels and is acceptable for use in contact with many acids)TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials.Information Provided by Ensinger Inc.